Beskrivelse
Specifikt for denne variant: FITLET3 Barebone
fitlet3 barebone med Intel Processor
Bemærkelsesværdig forbedring af performance
fitlet3 outperfomrer den tidligere atom-baserede fitlet i næsten alle aspekter. Den er steget med op til 70% i CPU performance, grafisk performance er steget til op til det dobbelte og storage performance er blevet forbedret med op til 700%.
Det specialfremstillede motherboard til fitlet3 er blevet designet til at fuldt udnytte Intels mest avancerede Atom platform, som tillader op til 32GB, 3200MT/s DDR4 memory og et omfattende interface til industrien.
Derudover kan der tilføjes til interfacet med hjælp af en 3. generations FACET-kort (Function And Connectivity Extension T-kort):
- FC3-LAN: to mere 1Gb Ethernet porte op til en total af fire porte på RJ45 connectore.
- FC3-OPLN: 1GbE over SFP+ for optical LAN.
- FC3-POED: en enkelt 1Gb PoE Ethernet port.
Bred tilgang til krævende brugstilfælde
fitlet3 er designet med industriel automation, AI edge computing og IoT applikationer i fokus. Derfor er fitlet3 blevet designet til at kunne levere enestående værdi til et projekt i hvilket som helst scenario.
De følgende egenskaber gør fitlet3 ideal som en industriel control system, AI Edge computer eller en IoT gateway:
- Lille, blæserløs og robust.
- Induestriel temperatur rækkevidde tilgængelig: -40°C til 85°C.
- Bred spændingsinput mellem DC 7V til 42V.
- Omfangsrig wired og wireless tilslutningsmuligheder.
- Isolerede COM porte og GPIOs.
- Secure boot og TPM2.0 som tilvalg.
- 5 års garanti og 15 års tilgængelighed.
Vi gør opmærksom på, at ved bestilling af enkelte konfigurationsmuligheder, vil der være forlænget leveringstid.
Specifikationer
Model
Name |
fitlet3 Barebone |
Part Number |
FITLET3 |
Block Diagram |
fitlet3 Block Diagram |
Current HW Revision |
N/A |
Long Term Availability |
Yes - 15 years availability (specifications may be upgraded or changed) |
Processor
Type |
Intel Atom x6425E |
Intel Celeron J6412 |
Intel Atom x6211E |
Cores |
64-bit Quad Core |
64-bit Quad Core |
64-bit Dual Core |
Clock speed |
2.0GHz (boost up to 3.0GHz) |
2.0GHz (boost up to 2.6GHz) |
1.3GHz (boost up to 3.0GHz) |
TDP |
12W |
10W |
6W |
Chipset |
SoC (CPU and Chipset on the same die) |
Memory
Supported |
Up to 32 GB. 1x SO-DIMM 204-pin DDR4 Non-ECC DDR4-3200MT/S (1.35V) |
Installed |
Not installed |
Storage
Supported |
M.2 key-M NVMe or SATA (2242 | 2260 | 2280) |
M.2 key-B SATA (2242 | 2260) |
Optional 2.5" sotrage using SATA expansion |
Installed |
Not installed |
Displays
Display Interface 1 |
mini DP 1.2 4K @ 60 Hz Dual mode |
Display Interface 2 |
HDMI 1.4 4K @ 30 Hz |
Networking
LAN |
2x GbE Ethernet ports on RJ45 (1000 Mbps / 100 Mbps / 10 Mbps)
Additional 2x GbE LAN on RJ45 on FC3-LAN (optional)
Additional 1x GbE LAN on SFP+ for optical LAN on FC3-OPLN (optional)
Additional 1x GbE LAN on RJ45 with PoE device capabilities on FC3-POED (optional) |
Wireless |
Optional on-board module with Wi-Fi 6E, BT 5.2
For m.2 2230 module with Wi-Fi 6E, BT 5.2 |
Cellular Communication |
Optional m.2, LTE/5G modem, with micro-SIM tray |
I/O
USB |
4x USB2.0 on USB type-A
2x USB3.1 on USB type-A |
Audi |
Optional analog output, analog input on 3.5mm jack
Audio on display output via HDMI and miniDP |
Serial/GPIO |
Optional isolated serial port (RS-232/422/485) and GPIO, up to 24V, on terminal block
2x isolated GPI + 2x isolated GPO |
Extensions
Function And Connectivity Extension T-card (FACET-card) |
Available FACET cards:
FC3-LAN - 2x GbE LAN on RJ45
FC3-POED - GbE LAN PoE device on RJ45
FC3-OPLN - GbE on SFP+ for optic LAN
EB-M2SATA - SATA expansion for 2.5" HDD/SSD |
BIOS & OS
BIOS |
AMI Aptio V |
OS |
Windows 10 IoT Enterprise LTSC 2021
Windows 10 Pro
Windows 11 Pro
Linux Mint / Ubuntu
Compatible with other Windows 10/11 variants
Compatible with other Linux variants
Compatible with other hypervisors and operating systems (e.g. ESXi, FreeBSD) |
Power
Input voltage range |
DC 7V-42V |
Power consumption |
5W-25W
Power consumption depends on
CPU type
System load
Installed devices
Connected preipherals |
Temperature & humidity
Operating temperature range |
Commercial temperature range: 0°C-70°C
Extended temperature range: -20°C-70°C
Industrial temperature range: -40°C-85°C |
Relative humidity |
5%-95% non-condensing |
Shock and vibration
MIL STD 810G compliant |
Vibration test:
IEC TR 60721-4-7:2001+A1:03, Class 7M1, test method IEC 60068-2-64 (up to 2 KHz, 3 axis)
Shock test:
IEC TR 60721-4-7:2001+A1:03, Class 7M1, test method IEC 60068-2-27 (15g, 6 directions) |
Mechanical specifications
Dimensions |
Standard housing: 132.8mm x 100mm x 34.8mm |
Weight |
420 gram |
Housing |
All metal housing
Aluminium | zinc die cast pasrts |
Cooling |
Fanless convection cooling through housing
No vents |
Mounting |
VESA / wall mounting bracket
DIN-rail mounting bracket
Sold separately |
Additional features
Functional features |
Auto-on
Programmable indicator LEDs
Removable RTC battery
Auxiliary power head
RTC reset tactile switch
Trusted Platform Module (TPM)
Remote power button |
Firmware & BIOS features |
PXE boot
Wake-on-LAN
Wake-on-timer |
Mechanical features |
Kensington lock
Power plug twist lock
mechanical disabling of power button |
Services |
OEM rebranding incl logo and BIOS splash-screen
Build-to-order
Software imaging
Burn-in testing |