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Specifikt for denne variant: FITLET3 Barebone
fitlet3 barebone med Intel Processor

Bemærkelsesværdig forbedring af performance

fitlet3 outperfomrer den tidligere atom-baserede fitlet i næsten alle aspekter. Den er steget med op til 70% i CPU performance, grafisk performance er steget til op til det dobbelte og storage performance er blevet forbedret med op til 700%.

Det specialfremstillede motherboard til fitlet3 er blevet designet til at fuldt udnytte Intels mest avancerede Atom platform, som tillader op til 32GB, 3200MT/s DDR4 memory og et omfattende interface til industrien.

Derudover kan der tilføjes til interfacet med hjælp af en 3. generations FACET-kort (Function And Connectivity Extension T-kort):

  • FC3-LAN: to mere 1Gb Ethernet porte op til en total af fire porte på RJ45 connectore.
  • FC3-OPLN: 1GbE over SFP+ for optical LAN.
  • FC3-POED: en enkelt 1Gb PoE Ethernet port.

Bred tilgang til krævende brugstilfælde

fitlet3 er designet med industriel automation, AI edge computing og IoT applikationer i fokus. Derfor er fitlet3 blevet designet til at kunne levere enestående værdi til et projekt i hvilket som helst scenario.

De følgende egenskaber gør fitlet3 ideal som en industriel control system, AI Edge computer eller en IoT gateway:

  • Lille, blæserløs og robust.
  • Induestriel temperatur rækkevidde tilgængelig: -40°C til 85°C.
  • Bred spændingsinput mellem DC 7V til 42V.
  • Omfangsrig wired og wireless tilslutningsmuligheder.
  • Isolerede COM porte og GPIOs.
  • Secure boot og TPM2.0 som tilvalg.
  • 5 års garanti og 15 års tilgængelighed.

Vi gør opmærksom på, at ved bestilling af enkelte konfigurationsmuligheder, vil der være forlænget leveringstid.

Vægt 0,600 kg
Brand

CompuLab

Software availability

Linux Mint, Ubuntu Linux, Windows 10, Windows 11, Windows IoT Value

LAN ports

1, 2, 3, 4

Maximum displays

1, 2

NVMe availability

1

Serial ports

1, 2

Operating temperature

Down to -40°C, Up to 85°C

TPM availability

TPM2.0

USB ports

1, 2, 3, 4, 5, 6(+)

USB types

USB2.0 type A, USB3.0 type A

Video ports

HDMI, Mini DisplayPort

Voltage input

Up to 42V

Wireless network

4G, 5G, LTE-M, WiFi

Specifikationer

Model

Name fitlet3 Barebone
Part Number FITLET3
Block Diagram fitlet3 Block Diagram
Current HW Revision N/A
Long Term Availability Yes - 15 years availability (specifications may be upgraded or changed)

Processor

Type Intel Atom x6425E Intel Celeron J6412 Intel Atom x6211E
Cores 64-bit Quad Core 64-bit Quad Core 64-bit Dual Core
Clock speed 2.0GHz (boost up to 3.0GHz) 2.0GHz (boost up to 2.6GHz) 1.3GHz (boost up to 3.0GHz)
TDP 12W 10W 6W
Chipset SoC (CPU and Chipset on the same die)

Memory

Supported Up to 32 GB. 1x SO-DIMM 204-pin DDR4 Non-ECC DDR4-3200MT/S (1.35V)
Installed Not installed

Storage

Supported M.2 key-M NVMe or SATA (2242 | 2260 | 2280) M.2 key-B SATA (2242 | 2260) Optional 2.5" sotrage using SATA expansion
Installed Not installed

Displays

Display Interface 1 mini DP 1.2 4K @ 60 Hz Dual mode
Display Interface 2 HDMI 1.4 4K @ 30 Hz

Networking

LAN 2x GbE Ethernet ports on RJ45 (1000 Mbps / 100 Mbps / 10 Mbps)
Additional 2x GbE LAN on RJ45 on FC3-LAN (optional)
Additional 1x GbE LAN on SFP+ for optical LAN on FC3-OPLN (optional)
Additional 1x GbE LAN on RJ45 with PoE device capabilities on FC3-POED (optional)
Wireless Optional on-board module with Wi-Fi 6E, BT 5.2
For m.2 2230 module with Wi-Fi 6E, BT 5.2
Cellular Communication Optional m.2, LTE/5G modem, with micro-SIM tray

I/O

USB 4x USB2.0 on USB type-A
2x USB3.1 on USB type-A
Audi Optional analog output, analog input on 3.5mm jack
Audio on display output via HDMI and miniDP
Serial/GPIO Optional isolated serial port (RS-232/422/485) and GPIO, up to 24V, on terminal block
2x isolated GPI + 2x isolated GPO

Extensions

Function And Connectivity Extension T-card (FACET-card) Available FACET cards:
FC3-LAN - 2x GbE LAN on RJ45
FC3-POED - GbE LAN PoE device on RJ45
FC3-OPLN - GbE on SFP+ for optic LAN
EB-M2SATA - SATA expansion for 2.5" HDD/SSD

BIOS & OS

BIOS AMI Aptio V
OS Windows 10 IoT Enterprise LTSC 2021
Windows 10 Pro
Windows 11 Pro
Linux Mint / Ubuntu

Compatible with other Windows 10/11 variants
Compatible with other Linux variants
Compatible with other hypervisors and operating systems (e.g. ESXi, FreeBSD)

Power

Input voltage range DC 7V-42V
Power consumption 5W-25W

Power consumption depends on
CPU type
System load
Installed devices
Connected preipherals

Temperature & humidity

Operating temperature range Commercial temperature range: 0°C-70°C
Extended temperature range: -20°C-70°C
Industrial temperature range: -40°C-85°C
Relative humidity 5%-95% non-condensing

Shock and vibration

MIL STD 810G compliant Vibration test:
IEC TR 60721-4-7:2001+A1:03, Class 7M1, test method IEC 60068-2-64 (up to 2 KHz, 3 axis)

Shock test:
IEC TR 60721-4-7:2001+A1:03, Class 7M1, test method IEC 60068-2-27 (15g, 6 directions)

Mechanical specifications

Dimensions Standard housing: 132.8mm x 100mm x 34.8mm
Weight 420 gram
Housing All metal housing
Aluminium | zinc die cast pasrts
Cooling Fanless convection cooling through housing
No vents
Mounting VESA / wall mounting bracket
DIN-rail mounting bracket

Sold separately

Additional features

Functional features Auto-on
Programmable indicator LEDs
Removable RTC battery
Auxiliary power head
RTC reset tactile switch
Trusted Platform Module (TPM)
Remote power button
Firmware & BIOS features PXE boot
Wake-on-LAN
Wake-on-timer
Mechanical features Kensington lock
Power plug twist lock
mechanical disabling of power button
Services OEM rebranding incl logo and BIOS splash-screen
Build-to-order
Software imaging
Burn-in testing

fitlet3

2.805,33 kr. 3.506,66 kr.