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Specifikt for denne variant: FITLET3 Barebone
fitlet3 barebone med Intel Processor
Bemærkelsesværdig forbedring af performance
fitlet3 outperfomrer den tidligere atom-baserede fitlet i næsten alle aspekter. Den er steget med op til 70% i CPU performance, grafisk performance er steget til op til det dobbelte og storage performance er blevet forbedret med op til 700%.
Det specialfremstillede motherboard til fitlet3 er blevet designet til at fuldt udnytte Intels mest avancerede Atom platform, som tillader op til 32GB, 3200MT/s DDR4 memory og et omfattende interface til industrien.
Derudover kan der tilføjes til interfacet med hjælp af en 3. generations FACET-kort (Function And Connectivity Extension T-kort):
- FC3-LAN: to mere 1Gb Ethernet porte op til en total af fire porte på RJ45 connectore.
- FC3-OPLN: 1GbE over SFP+ for optical LAN.
- FC3-POED: en enkelt 1Gb PoE Ethernet port.
Bred tilgang til krævende brugstilfælde
fitlet3 er designet med industriel automation, AI edge computing og IoT applikationer i fokus. Derfor er fitlet3 blevet designet til at kunne levere enestående værdi til et projekt i hvilket som helst scenario.
De følgende egenskaber gør fitlet3 ideal som en industriel control system, AI Edge computer eller en IoT gateway:
- Lille, blæserløs og robust.
- Induestriel temperatur rækkevidde tilgængelig: -40°C til 85°C.
- Bred spændingsinput mellem DC 7V til 42V.
- Omfangsrig wired og wireless tilslutningsmuligheder.
- Isolerede COM porte og GPIOs.
- Secure boot og TPM2.0 som tilvalg.
- 5 års garanti og 15 års tilgængelighed.
Vi gør opmærksom på, at ved bestilling af enkelte konfigurationsmuligheder, vil der være forlænget leveringstid.
| Vægt | 0,600 kg |
|---|---|
| Brand | CompuLab |
| Software availability | Linux Mint, Ubuntu Linux, Windows 10, Windows 11, Windows IoT Value |
| LAN ports | 1, 2, 3, 4 |
| Maximum displays | 1, 2 |
| NVMe availability | 1 |
| Serial ports | 1, 2 |
| Operating temperature | Down to -40°C, Up to 85°C |
| TPM availability | TPM2.0 |
| USB ports | 1, 2, 3, 4, 5, 6(+) |
| USB types | USB2.0 type A, USB3.0 type A |
| Video ports | HDMI, Mini DisplayPort |
| Voltage input | Up to 42V |
| Wireless network | 4G, 5G, LTE-M, WiFi |
Specifikationer
Model
| Name | fitlet3 Barebone |
| Part Number | FITLET3 |
| Block Diagram | fitlet3 Block Diagram |
| Current HW Revision | N/A |
| Long Term Availability | Yes - 15 years availability (specifications may be upgraded or changed) |
Processor
| Type | Intel Atom x6425E | Intel Celeron J6412 | Intel Atom x6211E |
| Cores | 64-bit Quad Core | 64-bit Quad Core | 64-bit Dual Core |
| Clock speed | 2.0GHz (boost up to 3.0GHz) | 2.0GHz (boost up to 2.6GHz) | 1.3GHz (boost up to 3.0GHz) |
| TDP | 12W | 10W | 6W |
| Chipset | SoC (CPU and Chipset on the same die) |
Memory
| Supported | Up to 32 GB. 1x SO-DIMM 204-pin DDR4 Non-ECC DDR4-3200MT/S (1.35V) |
| Installed | Not installed |
Storage
| Supported | M.2 key-M NVMe or SATA (2242 | 2260 | 2280) | M.2 key-B SATA (2242 | 2260) | Optional 2.5" sotrage using SATA expansion |
| Installed | Not installed |
Displays
| Display Interface 1 | mini DP 1.2 4K @ 60 Hz Dual mode |
| Display Interface 2 | HDMI 1.4 4K @ 30 Hz |
Networking
| LAN | 2x GbE Ethernet ports on RJ45 (1000 Mbps / 100 Mbps / 10 Mbps) Additional 2x GbE LAN on RJ45 on FC3-LAN (optional) Additional 1x GbE LAN on SFP+ for optical LAN on FC3-OPLN (optional) Additional 1x GbE LAN on RJ45 with PoE device capabilities on FC3-POED (optional) |
| Wireless | Optional on-board module with Wi-Fi 6E, BT 5.2 For m.2 2230 module with Wi-Fi 6E, BT 5.2 |
| Cellular Communication | Optional m.2, LTE/5G modem, with micro-SIM tray |
I/O
| USB | 4x USB2.0 on USB type-A 2x USB3.1 on USB type-A |
| Audi | Optional analog output, analog input on 3.5mm jack Audio on display output via HDMI and miniDP |
| Serial/GPIO | Optional isolated serial port (RS-232/422/485) and GPIO, up to 24V, on terminal block 2x isolated GPI + 2x isolated GPO |
Extensions
| Function And Connectivity Extension T-card (FACET-card) | Available FACET cards: FC3-LAN - 2x GbE LAN on RJ45 FC3-POED - GbE LAN PoE device on RJ45 FC3-OPLN - GbE on SFP+ for optic LAN EB-M2SATA - SATA expansion for 2.5" HDD/SSD |
BIOS & OS
| BIOS | AMI Aptio V |
| OS | Windows 10 IoT Enterprise LTSC 2021 Windows 10 Pro Windows 11 Pro Linux Mint / Ubuntu Compatible with other Windows 10/11 variants Compatible with other Linux variants Compatible with other hypervisors and operating systems (e.g. ESXi, FreeBSD) |
Power
| Input voltage range | DC 7V-42V |
| Power consumption | 5W-25W Power consumption depends on CPU type System load Installed devices Connected preipherals |
Temperature & humidity
| Operating temperature range | Commercial temperature range: 0°C-70°C Extended temperature range: -20°C-70°C Industrial temperature range: -40°C-85°C |
| Relative humidity | 5%-95% non-condensing |
Shock and vibration
| MIL STD 810G compliant | Vibration test: IEC TR 60721-4-7:2001+A1:03, Class 7M1, test method IEC 60068-2-64 (up to 2 KHz, 3 axis) Shock test: IEC TR 60721-4-7:2001+A1:03, Class 7M1, test method IEC 60068-2-27 (15g, 6 directions) |
Mechanical specifications
| Dimensions | Standard housing: 132.8mm x 100mm x 34.8mm |
| Weight | 420 gram |
| Housing | All metal housing Aluminium | zinc die cast pasrts |
| Cooling | Fanless convection cooling through housing No vents |
| Mounting | VESA / wall mounting bracket DIN-rail mounting bracket Sold separately |
Additional features
| Functional features | Auto-on Programmable indicator LEDs Removable RTC battery Auxiliary power head RTC reset tactile switch Trusted Platform Module (TPM) Remote power button |
| Firmware & BIOS features | PXE boot Wake-on-LAN Wake-on-timer |
| Mechanical features | Kensington lock Power plug twist lock mechanical disabling of power button |
| Services | OEM rebranding incl logo and BIOS splash-screen Build-to-order Software imaging Burn-in testing |
fitlet3
2.805,33 kr. 3.506,66 kr.
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